Intel will bring a performance-improving feature to its chips one year ahead of TSMC

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Intel will bring a performance-improving feature to its chips one year ahead of TSMC
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. Intel is looking to challenge TSMC and Samsung Foundry in the contract foundry segment of the industry. A contract foundry takes the chip designs from fabless chip designers and manufacturers the chip. TSMC is the global leader followed by Samsung Foundry.

So what is PowerVia? Most of the small wires that deliver power to a chip are found on top of all of the layers that make up a silicon component. As these chips become more powerful and complex, the wires on top that connect to power sources are competing with the wires that connect components. This results in wasted power and low efficiency.

the first company to take delivery of its $400 million High-NA Extreme Ultraviolet Lithography machine

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